Jobs
  • FAE engineer
    Job classification: Engineering class
    Job Location: Shanghai
    Number of Recruits: 1

    Job description:

     

    1. Responsible for TP/module factory/Panel factory customer new project performance requirements evaluation, schematic check, layout/sensor design check, FW initial version debugging

    2. Familiar with module output test and related electrical tests, etc., responsible for TP factory/module factory project follow-up and exception handling

    3. Responsible for the verification of the new IC on the client side, and complete the verification related documents

    4. Project evaluation, hardware inspection, routine debugging, exception handling, defect analysis, etc.


    Job requirements:

     

    1. Bachelor degree or above, major in computer, electronic communication, etc., strong working ability can be relaxed to college degree

    2. Familiar with C language, familiar with C51, Arm and other conventional MCU architectures and Keil and other compilation environments

    3. Have basic electronic circuit knowledge, can draw and understand schematic diagrams, and can lay out simple PCBs. Basic analysis tools such as oscilloscope, multimeter, etc. can be used

    4. Have good communication skills, good logical analysis skills, flexible handling of problems, good pressure resistance and learning spirit

  • Embedded Software Engineer
    Job classification: Engineering class
    Job Location: Changsha
    Number of Recruits: 3

    Job description:

     

    1. Responsible for the development of relevant firmware and mass production tool software for fingerprint recognition and other biometric products

    2. In-depth cooperation with Windows or Linux driver engineers to design and develop fingerprint recognition project software

    3. Track and solve problems in the process of customer testing and mass production, assist customers in solving problems, and bring products to the market stably

     

    Job requirements:

     

    1. With more than 3 years of embedded development experience, proficient in C/C++ language programming, with good coding style

    2. Experience in using at least one MCU to develop projects, such as ST/GD/NXP series microcontrollers

    3. Have a certain hardware foundation, be able to understand the schematic diagram, be familiar with the peripheral circuits of the single-chip microcomputer, and master the debugging and testing methods of electronic products

    4. Familiar with various peripheral interface technologies, such as I2C/SPI/UART/USB

    5. Ability to design, debug and write software

    6. Have good teamwork spirit, communication skills, high sense of responsibility and certain pressure resistance

  • Algorithm engineer
    Job classification: R & D class
    Job Location: Changsha
    Number of Recruits: 1

    Job description:

     

    1. Research and optimization of image processing algorithms

    2. Development and optimization of capacitive fingerprint recognition algorithm

    3. Research and development of ultrasonic fingerprint algorithm

    4. Sensor Signal Processing and Enhancement


    Job requirements:

     

    1. Bachelor degree or above, major in computer/electronics and communication/mathematics, etc.

    2. More than two years of working experience in image algorithm or deep learning, master basic image processing skills, have actual image matching processing experience, and be familiar with basic image matching methods

    4. Proficiency in image processing or data analysis using OpenCV, Halcon or matlab

    5. Proficiency in C language or C++ programming

    6. Have teamwork spirit, be diligent and work hard, and have a strong sense of responsibility

    7. Experience in ultrasound image processing is preferred

  • Digital IC Design Engineer
    Job classification: R & D class
    Job Location: Changsha
    Number of Recruits: 3

    Job description:

     

    1. Discuss and define the specification of the module

    2. RTL code design, development and maintenance

    3. Verify or debug on the FPGA

    4. Participate in the development of SoC or ASIC from RTL verification, synthesis, timing analysis, etc.

     

    Job requirements:

     

    1. Bachelor degree or above in microelectronics/communication/computer and other related majors

    2. More than 2 years working experience in digital IC design, proficient in Verilog language

    3. Experience in SOC/ASIC design, familiar with SOC system, including 8051, ARM core, AHB bus, etc.; familiar with IC front-end design process

    4. Experience of many successful tapeouts

    5. Have strong learning ability and teamwork ability

  • Analog IC Design Engineer
    Job classification: R & D class
    Job Location: Changsha
    Number of Recruits: 3

    Job description:

     

    1. Responsible for TP product analog circuit design, participate in TP product testing scheme design and specification formulation

    2. Instruct layout colleagues to complete the layout design of the circuit in charge

    3. Instruct and assist verification engineers to complete product verification and support project application development

    4. Cause analysis of technical problems encountered in the mass production process, study improvement plans, and analysis of defective products

     

    Job requirements:


    1. More than 2 years working experience in analog circuit design

    2. Proficient in the working principles and design points of common analog circuit modules such as bandgap, ldo, oscillator, operation amplifier, ADC, DAC, etc.

    3. Proficient in using Cadence, Hspice and other design and simulation tools

    4. Familiar with layout and semiconductor manufacturing process, experience in driving circuit and sensor control circuit design is preferred, and experience in project mass production is preferred

  • Linux Software Engineer - Capacitive Fingerprint FAE Direction
    Job classification: Engineering class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    Responsible for the software development and debugging of the company's fingerprint products, cooperate with the terminal to debug the fingerprint driver and deploy the fingerprint program, and provide a stable and high-performance user experience. Bringing pre-proven ICs to end customers, providing software solutions that will run on ICs and devices with monthly shipments of more than one million. Will be involved in or responsible for some of the following content to provide customers with fingerprint software solutions on Android and other Linux systems.
    1. Responsible for the development and debugging of biometric identification, and solve the technical problems encountered in the mass production projects of important customers.
    2. Support important customers and complete project mass production

     

    Job requirements:

     

    1. 2 years or above working experience in C language software development, with good coding style.
    2. Familiar with Linux drivers and have a certain understanding of subsystem frameworks such as GPIO/Pinctl/SPI.
    3. Familiar with the use of common Linux commands and svn tools.
    4. Good communication skills, high sense of responsibility and teamwork experience
    5. Experience in fingerprint identification is preferred

  • Chip packaging and testing engineer
    Job classification: Manufacturing
    Job Location: Hefei
    Number of Recruits: 1

    Job description:

     

    1. Responsible for the design and evaluation of various packaging forms of chips

    2. Participate in the formulation of internal packaging design flow and the improvement of process documents; formulation and maintenance of manufacturing related documents

    3. Audit of new outsourced packaging and testing foundries and import of quality system files

    4. Regularly audit outsourcing factories and continuously improve outsourcing quality related and follow-up through weekly meetings

    5. Outsourcing quality exception handling

    6. Feedback on customer problems related to operation and promotion of related corrective measures

     

    Job requirements:


    1. Bachelor degree or above

    2. More than 3 years experience in semiconductor packaging, familiar with various requirements and yield control of IC products imported from engineering NPI to mass production MP, with experience in yield improvement, Cost Down, NPI import, etc.

    3. Experience in RA and Reliability of packaging reliability

    4. Experience in traditional packaging and testing, LCD Driver process or LCM module

    5. Able to independently complete the evaluation and selection of package BOM

    6. Experience in quality system ISO9001 audit is preferred

    7. Positive work attitude, high initiative, strong sense of responsibility, clear thinking, strong organizational and coordination ability, strong statistical data analysis ability

    8. Short-term domestic or foreign business trips are acceptable

  • Chip packaging and testing engineer
    Job classification: Manufacturing
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. Bachelor degree or above

    2. More than 3 years experience in semiconductor packaging, familiar with various requirements and yield control of IC products imported from engineering NPI to mass production MP, with experience in yield improvement, Cost Down, NPI import, etc.

    3. Experience in RA and Reliability of packaging reliability

    4. Experience in traditional packaging and testing, LCD Driver process or LCM module

    5. Able to independently complete the evaluation and selection of package BOM

    6. Experience in quality system ISO9001 audit is preferred

    7. Positive work attitude, high initiative, strong sense of responsibility, clear thinking, strong organizational and coordination ability, strong statistical data analysis ability

    8. Short-term domestic or foreign business trips are acceptable

     

    Job requirements:

     

    1. Bachelor degree or above

    2. More than 3 years experience in semiconductor packaging, familiar with various requirements and yield control of IC products imported from engineering NPI to mass production MP, with experience in yield improvement, Cost Down, NPI import, etc.

    3. Experience in RA and Reliability of packaging reliability

    4. Experience in traditional packaging and testing, LCD Driver process or LCM module

    5. Able to independently complete the evaluation and selection of package BOM

    6. Experience in quality system ISO9001 audit is preferred

    7. Positive work attitude, high initiative, strong sense of responsibility, clear thinking, strong organizational and coordination ability, strong statistical data analysis ability

    8. Short-term domestic or foreign business trips are acceptable

  • Linux software engineer - optical fingerprint AE direction
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    Responsible for the development of the company's fingerprint recognition software, design algorithms and implement software functions to cope with various use environments, and provide a stable and high-performance user experience. Bringing pre-proven ICs to end customers, providing software solutions that will run on ICs and devices with monthly shipments of more than one million.

    Will be involved in or responsible for some of the following content to provide customers with fingerprint software solutions on Android and other Linux systems.

     


    1. Develop HAL layer related software to adapt to terminal manufacturers and third-party security TEE OS

    2. Solve the technical problems encountered in the mass production projects of important customers and optimize the performance

    3. Develop public programs and tools to facilitate debugging by FAE and other support personnel

    4. Support important customers and complete project mass production

     

    Job requirements:

     

    1. Three years or above working experience in C language software development, with good coding style.

    2. Familiar with Linux drivers and basic Android framework, and understand the communication mechanism between the kernel and users.

    3. Have a good Linux foundation, familiar with makefiles, shell scripts; familiar with GPIO\SPI and other subsystems.

    4. Can cooperate with the team to complete software design, analysis, debugging and testing according to customer needs.

    5. Have good teamwork spirit, communication skills, high sense of responsibility and certain pressure resistance.

  • Android Linux driver engineer
    Job classification: Engineering class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. Proficient in linux driver development and familiar with Android architecture.

    2. Proficient in C language.

    3. Familiar with ARM/X86 and other platforms.

    4. Ability to read and write in English, able to read original documents in English and communicate with customers by email in English.

    5. If you have worn it, experience in vehicle startup is preferred.

    6. Experience in Android mobile phone development is preferred.

     

    Job requirements:

     

    1. Android (Linux) public version driver development of new Touch IC, and driver maintenance and support for old IC.

    2. Part of the development of Andorid, including but not limited to: LCD driver, emmc, USB, LAN, Android system (HAL layer development, APK development, android framework development, etc.).

    3. Smart wearable system development (BT/WIFI, etc.), vehicle OS development.

    4. Compilation and arrangement of relevant documents.

    5. Major customer project support and assist FAE to solve problems.

    6. Other tasks scheduled.

  • FAE (Touch direction)
    Job classification: Engineering class
    Job Location: Shanghai
    Number of Recruits: 1

    Job description:

     

    1. Responsible for TP/module factory/Panel factory customer new project performance requirements evaluation, schematic check, layout/sensor design check, FW initial version debugging

    2. Familiar with module output test and related electrical tests, etc., responsible for TP factory/module factory project follow-up and exception handling

    3. Responsible for the verification of the new IC on the client side, and complete the verification related documents

    4. Project evaluation, hardware inspection, routine debugging, exception handling, defect analysis, etc.

     

    Job requirements:

     

    1. Bachelor degree or above, major in computer, electronic communication, etc., strong working ability can be relaxed to college degree

    2. Familiar with C language, familiar with C51, Arm and other conventional MCU architectures and Keil and other compilation environments

    3. Have basic electronic circuit knowledge, can draw and understand schematic diagrams, and can lay out simple PCBs. Basic analysis tools such as oscilloscope, multimeter, etc. can be used

    4. Have good communication skills, good logical analysis skills, flexible handling of problems, good pressure resistance and learning spirit

  • Digital Backend Engineer
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. According to the design requirements, logic synthesis;

    2. Digital automatic layout and routing;

    3. Static timing analysis;

    4. Physically verify DRC, LVS.

     

    Job requirements:

     

    1. Bachelor degree or above, major in microelectronics/electronics and communication/circuits and systems/electronic information science and technology

    2. 3-5 years digital back-end work experience

    3. Familiar with the RTL to GDS process and method of digital integrated circuit back-end design, familiar with TCL or perl language;

    4. Familiar with the use of mainstream EDA tools in the digital back-end, DC, ICC/Encounter, PT, etc., experience is better.

  • Analog IC Design Engineer
    Job classification: R & D class
    Job Location: Hefei
    Number of Recruits: 3

    Job description:


    1. Responsible for TP product analog circuit design, participate in TP product testing scheme design and specification formulation

    2. Instruct layout colleagues to complete the layout design of the circuit in charge

    3. Instruct and assist verification engineers to complete product verification and support project application development

    4. Cause analysis of technical problems encountered in the mass production process, study improvement plans, and analysis of defective products

     

    Job requirements:

     

    1. More than 2 years working experience in analog circuit design

    2. Proficient in the working principles and design points of common analog circuit modules such as bandgap, ldo, oscillator, operation amplifier, ADC, DAC, etc.

    3. Proficient in using Cadence, Hspice and other design and simulation tools

    4. Familiar with layout and semiconductor manufacturing process, experience in driving circuit and sensor control circuit design is preferred, and experience in project mass production is preferred

  • Analog IC Design Engineer
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 3

    Job description:

     

    1. Responsible for TP product analog circuit design, participate in TP product testing scheme design and specification formulation

    2. Instruct layout colleagues to complete the layout design of the circuit in charge

    3. Instruct and assist verification engineers to complete product verification and support project application development

    4. Cause analysis of technical problems encountered in the mass production process, study improvement plans, and analysis of defective products

     

    Job requirements:

     

    1. More than 2 years working experience in analog circuit design

    2. Proficient in the working principles and design points of common analog circuit modules such as bandgap, ldo, oscillator, operation amplifier, ADC, DAC, etc.

    3. Proficient in using Cadence, Hspice and other design and simulation tools

    4. Familiar with layout and semiconductor manufacturing process, experience in driving circuit and sensor control circuit design is preferred, and experience in project mass production is preferred

  • Digital IC Design Engineer
    Job classification: R & D class
    Job Location: Hefei
    Number of Recruits: 3

    Job description:

     

    1. Discuss and define the specification of the module

    2. RTL code design, development and maintenance

    3. Verify or debug on the FPGA

    4. Participate in the development of SoC or ASIC from RTL verification, synthesis, timing analysis, etc.

     

    Job requirements:

     

    1. Bachelor degree or above in microelectronics/communication/computer and other related majors

    2. More than 2 years working experience in digital IC design, proficient in Verilog language

    3. Experience in SOC/ASIC design, familiar with SOC system, including 8051, ARM core, AHB bus, etc.; familiar with IC front-end design process

    4. Experience of many successful tapeouts

    5. Have strong learning ability and teamwork ability

  • Digital IC Design Engineer
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 3

    Job description:


    1. Discuss and define the specification of the module

    2. RTL code design, development and maintenance

    3. Verify or debug on the FPGA

    4. Participate in the development of SoC or ASIC from RTL verification, synthesis, timing analysis, etc.

     

    Job requirements:


    1. Bachelor degree or above in microelectronics/communication/computer and other related majors

    2. More than 2 years working experience in digital IC design, proficient in Verilog language

    3. Experience in SOC/ASIC design, familiar with SOC system, including 8051, ARM core, AHB bus, etc.; familiar with IC front-end design process

    4. Experience of many successful tapeouts

    5. Have strong learning ability and teamwork ability

  • Algorithm engineer
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. Help the FW team process sensor images, optimize existing algorithms and design new algorithms

    2. Analyze and find solutions for abnormal problems in the project. Including but not limited to data analysis, program debugging, etc.

    3. Occasional involvement in customer support

    4. Other work related to chip design

     

    Job requirements:

     

    1. More than 3 years relevant work experience

    2. Proficiency in digital image processing technology, in-depth research on image noise reduction filtering, binarization processing, feature extraction, etc.

    3. Have experience in digital signal processing, understand how to adapt hardware to optimize algorithms, and be able to operate basic oscilloscopes and other instruments

    4. Must master matlab, python and other high-level languages, those who can transplant C language are preferred

    5. Have good teamwork and a certain ability to work under pressure. Have good communication and coordination skills

  • Senior Firmware Engineer
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:


    Lead the firmware development team, responsible for the company's fingerprint recognition software development. Design algorithms and implement software functions to cope with various usage environments and provide a user experience with stability and excellent performance. The software solutions provided will run on ICs and devices with monthly shipments of more than 10 million

    1. Responsible for firmware verification of the IC to ensure the design meets specifications

    2. Responsible for providing systematic mass production testing solutions, conducting adequate mass production evaluations, and ensuring product mass production stability

    3. Responsible for providing software application solutions to optimize fingerprint product performance and user experience

    4. Responsible for improving the technical ability of team members and standardizing team procedures

    5. Participate in the development of system verification solutions for new products

     

    Job requirements:

     

    1. Passionate about technical research, serious and responsible, able to accept challenges and work under pressure

    2. Good programming practices, good sense of teamwork

    3. Familiar with ARM and general MCU architecture

    4. More than five years of embedded development experience

    5. More than two years of small team management experience

    6. Experience in successful mass production of large-scale products

     

    The following relevant experience is preferred:

    Experience in the development of human-computer interaction devices such as fingerprint recognition or face recognition, touch control, etc.

    Experience in product development related to Windows or Android

  • Embedded Software Engineer (Touch)
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 5

    Job description:

     

    1. Early chip development verification: chip software function definition and system resource evaluation, verification of AFE function modules, SOC (MCU) function modules, underlying Boot driver development, joint debugging of Display and Touch systems, and development of supporting tools

    2. Chip revision test verification

    3. Development and maintenance of system firmware

    4. Project development and support for Alpha clients

     

    Job requirements:

     

    1. Bachelor degree or above.

    2. 1-3 years experience in embedded software development.

    3. Proficient in C language, familiar with embedded software and hardware platforms and development tools

  • Embedded Software Engineer (Fingerprint)
    Job classification: R & D class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. Responsible for the development of relevant firmware and mass production tool software for fingerprint recognition and other biometric products

    2. In-depth cooperation with Windows or Linux driver engineers to design and develop fingerprint recognition project software

    3. Track and solve problems in the process of customer testing and mass production, assist customers in solving problems, and bring products to the market stably

     

    Job requirements:


    1. With more than 3 years of embedded development experience, proficient in C/C++ language programming, with good coding style

    2. Experience in using at least one MCU to develop projects, such as ST/GD/NXP series microcontrollers

    3. Have a certain hardware foundation, be able to understand the schematic diagram, be familiar with the peripheral circuits of the single-chip microcomputer, and master the debugging and testing methods of electronic products

    4. Familiar with various peripheral interface technologies, such as I2C/SPI/UART/USB

    5. Ability to design, debug and write software

    6. Have good teamwork spirit, communication skills, high sense of responsibility and certain pressure resistance

     


    The following relevant experience is preferred:

    1. Experience in the development of human-computer interaction devices such as fingerprint recognition or face recognition, touch control, etc.

    2. Experience in Windows or Android related product development

    3. Experience in successful mass production of large-scale products

  • Firmware Engineer (Touch)
    Job classification: Engineering class
    Job Location: Shenzhen
    Number of Recruits: 2

    Job description:

     

    IC verification, project support, touch screen firmware debugging, touch screen public version development

     

    Job requirements:

     

    1. More than 3 years working experience in microcontroller
    2. Proficient in C language, proficient in using single chip development environment and application development software
    3. Familiar with I2C, SPI communication protocol
    4. Experience in touch screen firmware development and debugging is preferred
    5. Experience in image processing is preferred
    6. Experience in touch screen IC factory is preferred

  • Firmware Engineer (TouchPad)
    Job classification: Engineering class
    Job Location: Shenzhen
    Number of Recruits: 2

    Job description:

     

    Touch screen firmware development and debugging

     

    Job requirements:

     

    1. More than 3 years working experience in microcontroller
    2. Proficient in C language, proficient in using single chip development environment and application development software
    3. Familiar with I2C, SPI communication protocol
    4. Experience in touch screen firmware development and debugging is preferred
    5. Experience in image processing is preferred
    6. Experience in touch screen IC factory is preferred
    7. Experience in product development such as smart wearables/mobile phones/tablets is preferred

  • FAE (Touch direction)
    Job classification: Engineering class
    Job Location: Shenzhen
    Number of Recruits: 1

    Job description:

     

    1. Responsible for project drive debugging, Touch machine performance and subjective performance debugging, algorithm addition and debugging of new functions, analysis of difficult problems, positioning and optimization
    2. Responsible for follow-up and handling of project problems, communication and coordination, and promote the smooth mass production of the project
    3. Responsible for the on-site preliminary analysis of the project's customer return defects, and assist in the follow-up internal non-performing analysis work
    4. Assist in solving difficult problems encountered by other colleagues

     

    Job requirements:

     

    1. More than three years of undergraduate work experience in embedded software, major in computer, electronic communication, automation, etc.
    2. Proficient in C language, familiar with C51, Arm and other conventional MCU architectures and Keil and other compilation environments
    3. Have good basic knowledge of electronics and be proficient in using basic analysis tools such as oscilloscope and logic analyzer
    4. Have good communication and independent thinking skills, rich experience in debugging and problem solving and the ability to quickly analyze and solve problems, good pressure resistance and learning spirit, strong enterprising spirit, high work enthusiasm, willing to work Share and help team members